Auto Module Bonding Machine - Exporter & Manufacturer, Shenzhen, China

Auto Module Bonding Machine

Range of Application
The machine is for the connecting of copper wire antenna with the module in the production of RFID card.

Working principle

X axis take the bonding on direction of left and right moving.
Y axis take the bonding on direction of front and back moving.
The Cylinder make the sealing head up and down by the CPU control signal.
By advanced Ultrasonic technology, make the high electrical current bonding instantly.
Auto bonding with the two axis server system and PLC controlling.

Features

When machine running, the system will follow and adjust the ultrasonic parameter automatically.
CPU memory data bonding technology, use data freely when operating.
Two axis servo system ensures accuracy of welding position.
Color display screen with text is used, easy operating.
The alarm system will display error message with suggested solutions when machine is stopped.

Tech. Parameters

Out diameter:L1400*W1080mm*H1750mm
Weight:about1500Kg
Power:AC220V 50/60HZ
Compress air:6Kg/ C㎡
Control way: Two axis control+ computer
Ooerator:1 person
Working speed:1800～2500pcs/hour(related layout).

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Contact Details

EETII GROUP (CHINA) CO., LIMITED

Suit 19B, A Phase, Huamao Xinyun Building, Hongli West Road, Futian Dist., Shenzhen - 518034, Guangdong, China
Phone:86-755-82974518
Fax:86-755-61351612/8297476

Send Mail

Key Personnel

Mr. Adam Wag (Director)
Mobile:+8613316550505, +8613068448087